Anticorrosion device for electroplated conductive bar

• Main Authors: CHEN GANG, YANG HYUN-HO, LI JIAWEN
• Format: Patent
• Language: Chinese; English
• Published: 28.04.2023
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The utility model discloses an anti-corrosion device of an electroplating conductive plate, which comprises a conductive plate main body and an anti-corrosion component, the conductive plate main body comprises a square tube bracket and a conductive copper flat fixedly connected on the square tube bracket; the anti-corrosion assembly comprises a V-shaped baffle and a fixing sleeve, and an opening of the V-shaped baffle covers the conductive copper flat; one end of the fixing sleeve is fixed on the back face of the opening of the V-shaped baffle, and the other end of the fixing sleeve is fixed in the square tube support. According to the anti-corrosion device of the electroplated conductive bar, the V-shaped baffle and the fixing sleeve are adopted to provide a protective barrier for the conductive copper flat, liquid medicine on the square tube support is prevented from dripping on the conductive copper flat, and the service life of the conductive copper flat and the service life of the conductive copper flat