Anti-thimble flip chip structure

• Main Author: HUANG ZHANGTING
• Format: Patent
• Language: Chinese; English
• Published: 18.04.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model relates to the field of LED illumination, in particular to an anti-thimble flip chip structure, which comprises an electrode, the electrode comprises a bonding layer, a reflecting layer, a switching layer, a conducting layer and an adhesion layer which are sequentially superposed, and a buffer layer is arranged between the conducting layer and the adhesion layer. According to the anti-thimble flip chip structure provided by the utility model, the buffer layer is additionally arranged between the conductive layer and the adhesion layer of the motor, and the buffer layer can prevent the chip from being damaged and cracked when the chip is jacked up by the thimble, so that the structure is safe and reliable, and the service life of the chip is prolonged. 本实用新型涉及LED照明领域，尤其涉及一种防顶针的倒装芯片结构，包括电极，所述电极包括依次叠加的粘合层、反射层、转接层、导电层和粘附层，所述导电层和所述粘附层之间设有缓冲层。本实用新型提供一种防顶针的倒装芯片结构，通过在电机的导电层和粘附层之间增加缓冲层，缓冲层可以避免在顶针将芯片顶起的过程中芯片受到损伤导致开裂，安全可靠，延长了芯片的使用寿命。