EVA (Ethylene Vinyl Acetate) semi-conductive injection molding stress cone forming mold

• Main Authors: CHEN LIXIANG, HU FEI, WANG JUN, ZHANG JUNJIE, YANG XIANLIN, HUANG CHENGLONG, WANG XIAOBO, XU YONGJUN, XIE SHENGHAI, YAN XIFENG, LIU ZHIHAO
• Format: Patent
• Language: Chinese; English
• Published: 28.03.2023
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The utility model relates to the technical field of high-voltage cables, in particular to an EVA (Ethylene Vinyl Acetate) semi-conductive injection molding stress cone forming mold, which comprises a mold main body and is characterized in that the surface of the mold main body is provided with a threaded hole, and the mold main body comprises a mold cover, an upper mold, a cylindrical mold, a middle mold and a lower mold; one end of the glue injection nozzle whole body is provided with threads, the glue injection nozzle whole body is spirally connected with the mold main body, and the glue injection nozzle whole body comprises a glue injection nozzle and a glue injection nozzle nut. The utility model aims to solve the problem that a cable terminal stress control body without an air gap interface is formed by fusing, combining and cross-linking the cable insulation and a stress body by adopting the same insulation and semi-conductive white material as the cable between the cable body insulation and the termina