Vehicle-gauge-level multi-chip power type LED

• Main Authors: DONG XUEWEN, WEN YU, WEN YAOFA, TAO YONGWEI
• Format: Patent
• Language: Chinese; English
• Published: 24.03.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model provides a vehicle-gauge-level multi-chip power-type LED, which comprises a substrate, the substrate is a low-temperature sintering ceramic substrate composed of a metal layer and a ceramic layer, a transparent cover is fixed on the lower surface of the metal layer, a plurality of vehicle-gauge-level chips are arranged on the metal layer surface in the transparent cover, the plurality of vehicle-gauge-level chips are sequentially connected in parallel by a connecting wire, and the connecting wire is connected with the substrate. The connecting lines at the two ends of the ceramic layer are connected with the corresponding electrode pins respectively, and a plurality of cooling fins are symmetrically arranged on the left side and the right side of the upper surface of the ceramic layer. The beneficial effects of the utility model are that the radiating fins and the vertical tube are arranged together, and especially the vertical tube is arranged above the chip, so that the overall radiating e