Multilayer PCB exposure device

• Main Authors: ZHANG YAOJIE, FAN YUEYUAN, WEI KEWANG, ZHAO YONG
• Format: Patent
• Language: Chinese; English
• Published: 24.03.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS

The utility model discloses a multilayer PCB (Printed Circuit Board) exposure device which comprises a placing base, a fixing frame is fixedly arranged at the top of the placing base, a driving assembly convenient for automatically loading and unloading the multilayer PCB exposure device is arranged on the surface of the fixing frame, and a bottom plate is fixedly arranged on the surface of the fixing frame through the driving assembly; the surface of the bottom plate is provided with a multi-layer PCB carrying assembly which can be conveniently used in cooperation with the driving assembly, and the top of the placing base is provided with a conveying assembly which can conveniently convey the multi-layer PCBs. The exposed multi-layer PCB is conveyed out through the conveying assembly, and the exposed multi-layer PCB is placed in the left placing box through cooperative use of the driving assembly on the left side and the carrying assembly, so that the purpose of accurately placing the multi-layer PCB during