Printed circuit board with heat dissipation structure for artificial intelligence technology

• Main Authors: CHENG YUE, LUO CHENGLI
• Format: Patent
• Language: Chinese; English
• Published: 21.03.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model relates to the technical field of printed circuit boards, in particular to a printed circuit board with a heat dissipation structure for artificial intelligence technology, which comprises a circuit board body, a silica gel pad, a cooling block and a connecting mechanism, an L-shaped block is arranged at the bottom of the circuit board body, a mounting hole is formed in the L-shaped block, and the silica gel pad is arranged in the mounting hole. The cooling block is connected with the circuit board body through the connecting mechanism, and the silica gel pad is arranged between the cooling block and the circuit board body. The connecting mechanism comprises a first through groove, a first spring, a telescopic rod, a first connecting plate, a long block, a square through hole, a threaded groove, a threaded column, a clamping groove, a mounting block, a second through groove, a second spring, a cylinder, a round hole, a limiting block, a second connecting plate and a clamping block, and the f