Packaging body integrated with MCU and radio frequency chip, circuit board and electronic equipment

• Main Authors: HUANG GENGYU, TANG FENGRAO, LI HUANGXIAN, CHEN JIAXUN
• Format: Patent
• Language: Chinese; English
• Published: 21.03.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model belongs to the technical field of semiconductor packaging, and provides a packaging body integrating an MCU and a radio frequency chip, and the packaging body integrating the MCU and the radio frequency chip comprises a packaging housing, a substrate, a first bare chip, a second bare chip, and a plurality of pins. Wherein the first bare chip is a radio frequency bare chip, and the second bare chip is an MCU (Microprogrammed Control Unit) bare chip; the first bare chip and the second bare chip are both arranged on the surface of the substrate, and the first bare chip, the second bare chip and the substrate are all arranged in the packaging shell; and the first bare chip, the second bare chip, the substrate and the plurality of pins are electrically connected through bonding wires. According to the utility model, the packaging body integrated with the MCU and the radio frequency chip can realize the functions of the MCU and the radio frequency chip at the same time. 本实用新型属于半导体封装技术领域，提供了一种集成MCU