Processor

The utility model provides a processor. The processor comprises a case; the main board is mounted in the case; the processing chip is arranged on the main board; the first heat dissipation module is arranged on the side, away from the mainboard, of the processing chip, the first heat dissipation mod...

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Main Authors WANG XIAOHU, LI XIANGLONG, DONG JIAHAN, PAN MINGYU, REN TIANYU, ZHANG RUIFANG, LI BOWEN, JIN TONG, GUO GUANGXIN, YUAN XUEZHONG, WANG QIONG, WANG CHAO, WANG LIYONG
Format Patent
LanguageChinese
English
Published 21.02.2023
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Summary:The utility model provides a processor. The processor comprises a case; the main board is mounted in the case; the processing chip is arranged on the main board; the first heat dissipation module is arranged on the side, away from the mainboard, of the processing chip, the first heat dissipation module comprises a first semiconductor chilling plate, a first heat dissipation fin set and a first fan which are sequentially arranged in the direction away from the processing chip, and the problem that in the prior art, the heat dissipation effect of an information processor is poor is solved. 本实用新型提供了一种处理器,包括:机箱;主板,主板安装在机箱内;处理芯片,处理芯片设置在主板上;第一散热模块,设置在处理芯片的远离主板的一侧,第一散热模块包括沿远离处理芯片的方向依次设置的第一半导体制冷片、第一散热片组和第一风扇,以解决现有技术中的信息处理器的散热效果较差的问题。
Bibliography:Application Number: CN202222884117U