Orientation mold

The utility model relates to a preparation process of a high-resilience oriented heat-conducting interface material. The preparation process comprises the following steps: providing a mixed base material, pressing the mixed base material into an oriented mold, stacking heat-conducting glue layers la...

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Bibliographic Details
Main Authors ZHANG HAIXING, ZHENG JIAZHI, ZHOU XIAOYAN, LIN CUIYU
Format Patent
LanguageChinese
English
Published 31.01.2023
Subjects
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Summary:The utility model relates to a preparation process of a high-resilience oriented heat-conducting interface material. The preparation process comprises the following steps: providing a mixed base material, pressing the mixed base material into an oriented mold, stacking heat-conducting glue layers layer by layer, and cutting and processing a heat-conducting blank. The orientation mold comprises a multi-stage shunting pipeline and an orientation discharge nozzle communicated with the shunting pipeline, a plurality of closely arranged orientation grooves are formed in the orientation discharge nozzle, the mixed base material flows along the multi-stage shunting pipeline and is extruded to directionally arrange the carbon fibers, the mixed base material flows into the orientation discharge nozzle from the shunting pipeline, and the orientation discharge nozzle is communicated with the orientation grooves. And extruding from the plurality of orientation grooves to form the heat-conducting glue layer. According to
Bibliography:Application Number: CN202222682038U