Heat dissipation computer mainboard with temperature adjusting assembly

The utility model discloses a heat dissipation computer mainboard with a temperature adjusting assembly, which comprises a bottom plate and a mainboard arranged on the bottom plate, the bottom plate is provided with a heat dissipation cavity positioned right below the mainboard, the bottom plate is...

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Bibliographic Details
Main Authors WANG YAFU, XIONG YANG
Format Patent
LanguageChinese
English
Published 20.01.2023
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Summary:The utility model discloses a heat dissipation computer mainboard with a temperature adjusting assembly, which comprises a bottom plate and a mainboard arranged on the bottom plate, the bottom plate is provided with a heat dissipation cavity positioned right below the mainboard, the bottom plate is provided with heat dissipation holes which are communicated with the heat dissipation cavity and are in a matrix, and the front surface of the bottom plate is provided with an air inlet communicated with the heat dissipation cavity; heat on the mainboard enters the heat dissipation cavity in the bottom plate through the heat dissipation holes which are formed in the bottom plate in a matrix mode, air flow generated by the heat dissipation fan in work brings the heat in the heat dissipation cavity out of the air outlets in the two sides of the bottom plate, and therefore the heat on the mainboard can be conveniently discharged; the temperature of the mainboard is prevented from affecting normal use of electronic com
Bibliography:Application Number: CN202221952374U