Hot pressing sintering machine for packaging high-power semiconductor device

• Main Authors: DENG MENGZHONG, DU YUNBO
• Format: Patent
• Language: Chinese; English
• Published: 10.01.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model relates to the technical field of semiconductor device processing, in particular to a hot pressing sintering machine for packaging a high-power semiconductor device, which comprises a base frame, a sintering heating furnace is mounted in the base frame, a heating furnace door is hinged to the front end of the sintering heating furnace, and a supporting block is mounted in the sintering heating furnace. And a limiting baffle is installed at the rear end of the supporting block, a mold bottom plate is installed above the supporting block, a hot-pressing mold is installed above the mold bottom plate, and a mold cavity is formed in the hot-pressing mold. According to the hot pressing sintering machine for packaging the high-power semiconductor device, a roll-out motor is electrified to work to drive a roll-out transmission rod to anticlockwise rotate by 90 degrees, so that a bottom plate connecting plate and a mold connecting plate are driven to rotate, and the bottom plate connecting plate and