Touch module substrate with binding area provided with high-temperature-resistant thin film

• Main Authors: ZHENG YUNSONG, ZENG YIXIN
• Format: Patent
• Language: Chinese; English
• Published: 27.12.2022
• Subjects: CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PHYSICS; PRINTED CIRCUITS; TRANSPORTING

The utility model provides a touch module substrate with a binding area provided with a high-temperature-resistant film, which comprises a substrate body, a pattern part is arranged on the substrate body, and a second shadow eliminating layer and the high-temperature-resistant film positioned on the top surface of the second shadow eliminating layer are arranged on the pattern part. When the second shadow eliminating layer needs to be manufactured after the pattern part is manufactured, the high-temperature-resistant thin film is attached to the binding position of the pattern part before the second shadow eliminating layer is subjected to magnetron sputtering on the whole surface of the pattern part, so that the second shadow eliminating layer cannot be subjected to magnetron sputtering to the binding position, the binding position can be exposed by tearing off the high-temperature-resistant thin film, and the high-temperature-resistant thin film is not prone to being damaged. Compared with the prior art, th