Communication device with heat dissipation structure

The utility model relates to the field of communication devices, and discloses a communication device with a heat dissipation structure, which comprises a fixed seat, a communication device body and a protective shell, and the bottom of the communication device body is provided with a silica gel hea...

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Bibliographic Details
Main Author WU CHANGMIN
Format Patent
LanguageChinese
English
Published 23.12.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The utility model relates to the field of communication devices, and discloses a communication device with a heat dissipation structure, which comprises a fixed seat, a communication device body and a protective shell, and the bottom of the communication device body is provided with a silica gel heat conduction layer. According to the communication device with the heat dissipation structure, suction force can be formed after the miniature centrifugal fan is started, external air can enter the protection shell from the air outlet, and air in the protection shell can flow through the air inlet hole, penetrate through the miniature centrifugal fan and be exhausted from the air outlet; according to the communication device, external low-temperature air can continuously flow through the outside of the communication device body, and part of air can flow through the communication device body, so that heat of the communication device body can be actively dissipated, the heat dissipation effect of the communication de
Bibliography:Application Number: CN202221894133U