Positioning clamp for chip packaging

• Main Author: LU TIANYU
• Format: Patent
• Language: Chinese; English
• Published: 23.12.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model relates to a clamping device, in particular to a positioning clamp for chip packaging. The utility model provides a positioning clamp for chip packaging, which is simple to use and convenient for auxiliary fixation. A positioning clamp for chip packaging comprises a base, a fixing rod, a clamping plate, a spring, an air cylinder, a push plate and the like. A plurality of fixing rods are slidably connected to the front side and the rear side in the base, clamping plates are fixedly connected to the tail ends of the fixing rods, springs are arranged between telescopic rods of the clamping plates in a sleeving mode, an air cylinder is fixedly connected to the left side in the base, and a telescopic rod of the air cylinder is connected with a push plate through a key. Under the action of the air cylinder, the push plate and the clamping plate, people can be effectively assisted in fixing chips when packaging the chips, the operation process is extremely simple, and tedious steps during use can b