Integrated sensor forming die

• Main Authors: JIA YANHENG, LIU CHENG, ZHOU RENLING, CHAI NA, WANG MAOYU, QIU ZINAN, CAO LONGWEI, HAO FANYU, DIAN ERWEN, MAO YANPENG
• Format: Patent
• Language: Chinese; English
• Published: 23.12.2022
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The utility model discloses an integrated sensor forming mold, which is characterized in that an epoxy resin pouring mold comprises a static mold, a movable mold and a material injection mold, the material injection mold is buckled at the lower end after the static mold and the movable mold are buckled, and a plurality of cavities formed by buckling the static mold and the movable mold are communicated with a discharge port of the material injection mold through pouring gates which are arranged in an aligned manner; a through hole mold core for forming a sensor head through hole is arranged at the upper end of the mold cavity opposite to the sensor head; and a capacitance slot core for forming a sensor capacitance slot is arranged at the lower end of the cavity opposite to the tail part of the sensor. According to the utility model, the two dies can produce a plurality of sensor bodies in batches, and the sensor bodies are formed at one time, so that the efficiency is high and the packaging effect is good. 本实