Rapid cleaning device for welding die

• Main Authors: GU CHENGFENG, LI WEIZHEN, XU JUN, WANG YI, SHEN QINGQING
• Format: Patent
• Language: Chinese; English
• Published: 23.12.2022
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A rapid cleaning device for a welding die relates to semiconductor processing equipment. Comprising a bottom support in a plate shape; the plurality of ejector pins are respectively matched with exhaust holes of a welding die and are fixedly arranged on the bottom support; the limiting columns are fixedly arranged on the bottom support respectively, and a limiting cavity matched with a welding mold is formed; the height of the limiting column is larger than that of the ejector pin. Furthermore, a separation notch matched with the welding die is formed in the side portion of the bottom support. Furthermore, a conical part is arranged at the top of the ejector pin. Furthermore, the conical part is detachably and fixedly arranged at the top of the ejector pin. Furthermore, a chip guide groove is formed in the outer circular surface of the ejector pin. Furthermore, the chip guide groove extends from the top of the ejector pin to the bottom of the ejector pin. The utility model has the characteristics of compact s