Heat dissipation structure of circuit board

• Main Authors: JIA ZHONGYANG, SUN QILIN
• Format: Patent
• Language: Chinese; English
• Published: 20.12.2022
• Subjects: ACCESSORIES THEREFOR; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES; APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM; CINEMATOGRAPHY; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; PHOTOGRAPHY; PHYSICS; PICTORIAL COMMUNICATION, e.g. TELEVISION

A circuit board heat dissipation structure comprises a heat dissipation shell, a circuit board and a heat conduction pad. And a mounting space is formed in the heat dissipation shell. The circuit board is arranged in the installation space. The circuit board is provided with a to-be-cooled element. The element to be cooled is connected to the inner surface of the heat dissipation shell through the heat conduction pad. According to the heat dissipation structure provided by the utility model, the heat conduction pad with a higher heat conduction coefficient is filled between the to-be-cooled element and the heat dissipation shell, and the heat dissipation efficiency of the to-be-cooled element on the circuit board is improved by utilizing the high heat conduction coefficient of the heat conduction pad and respectively making full contact with the inner surface of the heat dissipation shell and the to-be-cooled element. Particularly, when the heat dissipation structure provided by the invention is applied to th