Stable integrated circuit heat dissipation device

The utility model discloses a stable integrated circuit heat dissipation device which comprises a heat dissipation substrate, an integrated circuit board is installed on the surface of the heat dissipation substrate, a protective cover plate is arranged at the bottom of the heat dissipation substrat...

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Bibliographic Details
Main Author KE MEIYAN
Format Patent
LanguageChinese
English
Published 13.12.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model discloses a stable integrated circuit heat dissipation device which comprises a heat dissipation substrate, an integrated circuit board is installed on the surface of the heat dissipation substrate, a protective cover plate is arranged at the bottom of the heat dissipation substrate, the protective cover plate and the heat dissipation substrate form a heat dissipation channel with openings in the two ends, and the protective cover plate is arranged on the heat dissipation channel. A metal heat dissipation block located in the heat dissipation channel is arranged at the bottom of the integrated circuit board, a plurality of heat dissipation fins parallel to the heat dissipation channel are arranged on the metal heat dissipation block, and a heat dissipation fan blowing air towards the metal heat dissipation block is installed in one end of the heat dissipation channel; l-shaped positioning edge strips are arranged on the peripheral side of the heat dissipation substrate. According to the util
Bibliography:Application Number: CN202221983102U