CPU (Central Processing Unit) heat dissipation device

The utility model discloses a CPU heat dissipation device which comprises an installation frame and heat dissipation fins, the heat dissipation fins are installed outside the installation frame, a fixing piece is arranged above the heat dissipation fins, an assembly bottom plate is arranged below th...

Full description

Saved in:
Bibliographic Details
Main Authors YANG KAI, PENG YIN, HU LINGFANG
Format Patent
LanguageChinese
English
Published 13.12.2022
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
Online AccessGet full text

Cover

More Information
Summary:The utility model discloses a CPU heat dissipation device which comprises an installation frame and heat dissipation fins, the heat dissipation fins are installed outside the installation frame, a fixing piece is arranged above the heat dissipation fins, an assembly bottom plate is arranged below the heat dissipation fins, an installation plate is fixedly connected above the fixing piece, and the installation plate is fixedly connected above the fixing piece. A copper pipe cooling fin is installed in the middle of the installation plate, cooling copper pipes are arranged at the two ends of the copper pipe cooling fin, and the cooling copper pipes are bent downwards to be connected into the fixing pieces. According to the CPU heat dissipation device, the heat dissipation fan blades, the heat dissipation fins, the heat dissipation copper pipes and the copper pipe heat dissipation fins are arranged, the heat dissipation device combines two modes of fan heat dissipation and copper pipe heat dissipation, the heat
Bibliography:Application Number: CN202222354277U