Electroplating plug-in frame for nickel-palladium gold wire

• Main Authors: DAI QIANYI, XU DONGDONG, DENG CONGFENG
• Format: Patent
• Language: Chinese; English
• Published: 09.12.2022
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The utility model discloses an electroplating plug-in frame for nickel-palladium gold wires, which comprises a plug-in frame body, a plurality of placing areas for placing circuit boards are arranged in the plug-in frame body, and hooks matched with electroplating wire hangers are arranged on the left side and the right side of the top of the plug-in frame body. The left side and the right side of the top of the plug-in frame body are further provided with upper limiting assemblies capable of extending to the position above the containing area, and the bottom of each upper limiting assembly is provided with a plurality of upper limiting slots used for limiting the upper board edge of the circuit board. The electroplating plug-in frame for the nickel-palladium gold wire can be matched with automatic equipment to place a certain number of circuit boards in the plug-in frame, and the upper limiting assembly extends out to limit the upper board edges of the circuit boards after the plug-in frame is full of the ci