Silicon wafer crystal point removing device

• Main Authors: TIAN DAXI, TONG KEFENG, ZHANG YINGUANG, LIANG XINGBO, LI SHENZHONG, JIANG YULONG, LI GANG
• Format: Patent
• Language: Chinese; English
• Published: 06.12.2022
• Subjects: PERFORMING OPERATIONS; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

The utility model relates to a silicon wafer crystal point removing device which comprises a bottom plate, vertical supports and a rotating machine table, the rotating machine table is vertically installed in the middle of the upper end face of the bottom plate, a silicon wafer is placed on a rotating table at the upper end of the rotating machine table, and the vertical supports are arranged at the two ends of the bottom plate. An extending knife rest is arranged on one side, close to the rotating machine table, of the upper end of the vertical support, a scraper corresponding to the lower side of the silicon wafer in an attached mode is installed on the extending knife rest, and a lifting table with a center suction cup is arranged in the middle of the upper end face of the rotating machine table; the upper end face of the rotating machine table is provided with a plurality of positioning suction cups which are evenly arranged and surround the lifting table. The device has the characteristics that the opera