Dispensing device

• Main Authors: ZHU PENGZHOU, HUANG KAI, PENG XIAOGANG, YAO YONG, DU JIANKANG, CHEN GUO
• Format: Patent
• Language: Chinese; English
• Published: 29.11.2022
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; PERFORMING OPERATIONS; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

The glue dispensing device comprises a fixed plate, and a glue guide mechanism, a glue dispensing mechanism and a condensation mechanism which are connected to the fixed plate. The glue guiding mechanism is used for guiding glue into the glue dispensing mechanism, and the condensing mechanism is used for cooling the glue in the glue guiding mechanism and the glue dispensing mechanism. The glue dispensing mechanism comprises a glue dispensing needle communicated with the glue guide mechanism and a heat conduction sleeve connected to the periphery of the glue dispensing needle in a sleeving mode, the heat conduction sleeve is provided with a first end and a second end, and the first end is in contact connection with the condensation mechanism. The dispensing device further comprises a water collecting mechanism, and the water collecting mechanism comprises a containing part and an adsorption part. The accommodating piece is provided with a first concave part; the first concave part is provided with a first bott