Inverter circuit board electroplating clamp

• Main Authors: ZHANG JICHONG, ZHANG GUOYAN, WANG CHANGSHANG
• Format: Patent
• Language: Chinese; English
• Published: 22.11.2022
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The utility model discloses an electroplating clamp for an inverter circuit board, and relates to the technical field of electroplating clamps. The lower end of the fixing frame is fixedly connected with a rubber clamping block, one side of the fixing frame is rotatably connected with a clamping block, one side of the clamping block is fixedly connected with a first spring, one end of the first spring is fixedly connected with the fixing frame, one side of the fixing frame is rotatably connected with a limiting block, and the upper end of the limiting block is fixedly connected with a second spring; one end of the second spring is fixedly connected with the fixing frame, the upper end of the clamping block is fixedly connected with a clamping block, and a clamping groove is formed in the lower end of the limiting block. Through the fixing frame, the rubber clamping block, the clamping block, the clamping block, a hollow rubber block, a first spring, a limiting block, a clamping groove and a second spring, the