MOPA laser marking device

• Main Author: LIU HANGUANG
• Format: Patent
• Language: Chinese; English
• Published: 15.11.2022
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The utility model discloses an MOPA laser marking device which comprises a base, a control host is installed at the position, close to the right side edge, of the top of the base, a fixing frame is arranged at the position, located on the left side of the control host, of the top of the base, the fixing frame is fixed to the base in a welded mode, and an installation frame is fixed to the left side of the fixing frame in a welded mode. The marking machine comprises a mounting frame, a marking machine body is mounted at the position, close to the bottom end, in the mounting frame, the bottom end of the marking machine body penetrates through the mounting frame, heat dissipation openings distributed in an array mode are formed in the positions, located on the left side and the right side of the marking machine body, of the bottom of the mounting frame, and a heat dissipation plate is mounted at the position, located above the marking machine body, in the mounting frame. The beneficial effects of the utility mod