Transfer platform and transfer system

• Main Authors: LYU YONGLIANG, JIANG JISHUI, CHEN DONGBAO, GUO FANSHI, ZHANG XIANLEI, LEI YOUXI
• Format: Patent
• Language: Chinese; English
• Published: 01.11.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a transfer platform and a transfer system, the transfer platform comprises a platform base and a first flexible suction nozzle arranged on the platform base, the platform base is provided with a first suction hole, and the first flexible suction nozzle is provided with a second suction hole communicated with the first suction hole. The first flexible suction nozzle is arranged on the platform base, so that the chip is in flexible contact with the transfer platform, and the chip can be prevented from being broken due to rigid contact between the chip and the platform base; and the first flexible suction nozzle also has an adsorption fixing effect on the chip, so that when the chip is transferred to the transfer platform, the position of the chip can be prevented from moving, and the packaging precision of the chip can be prevented from being influenced. 本实用新型公开了一种中转平台以及中转系统，中转平台包括平台底座以及设于平台底座上的第一柔性吸嘴，平台底座设有第一吸气孔，第一柔性吸嘴设有与第一吸气孔连通的第二吸气孔。通过在平台底座上设置第一柔性吸嘴，使得芯片与中转平台接触时为柔性接触，可避免芯片与平台底座的刚性