Assembly tool for reflow soldering of heat dissipation module

• Main Authors: WANG CHAOCONG, DING XINGQIANG, DU JIE, XIE YI
• Format: Patent
• Language: Chinese; English
• Published: 01.11.2022
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The utility model relates to an assembling tool for reflow soldering of a heat dissipation module, which comprises an upper base plate and a lower base plate, the upper base plate is buckled on the lower base plate, the lower base plate is provided with a die cavity for placing the heat dissipation module, the shape of the die cavity is matched with that of the heat dissipation module, and the upper parts of the inner walls of the die cavity incline outwards to form inclined planes. According to the assembly tool, the heat dissipation module can be conveniently demolded, the demolding efficiency is improved, the heat dissipation module can be conveniently and rapidly placed in the mold cavity during assembly, and the assembly efficiency is improved. 本实用新型涉及一种散热模组回流焊接用组装工装，包括上基板和下基板，上基板扣合在下基板上，下基板上设置有用于放置散热模组的模腔，模腔的形状和散热模组的形状相适应，模腔的内壁上部均向外倾斜形成倾斜面。本实用新型的组装工装，可以方便地进行散热模组的脱模，提高了脱模效率，也更便于在组装时快速地将散热模组放置于模腔中，提高了组装效率。