Improved copper deposition device for reducing copper particles on surface of PCB (Printed Circuit Board)

• Main Authors: YU RONGXIANG, XU YONGZHANG, WANG JIACHENG
• Format: Patent
• Language: Chinese; English
• Published: 25.10.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses an improved copper deposition device for reducing copper particles on a PCB (Printed Circuit Board) surface, which comprises a box body, a fixed plate and a lifting plate are arranged in an inner cavity of the box body in a bilateral symmetry manner, the lifting plate is arranged below the fixed plate, an up-down through threaded hole is formed in the lifting plate, vertical plates are symmetrically arranged on two sides of the bottom of the box body, and the bottom of the box body is provided with a through hole. A bottom plate is arranged at the bottom of the vertical plate, a motor box is arranged at the top of the bottom plate, a motor is arranged in the motor box, the output end of the top of the motor is connected with a screw rod, the top end of the screw rod penetrates through a threaded hole to be connected with a fixing plate bearing, and the screw rod is in threaded connection with the threaded hole. The lifting plate drives the frame plate, the longitudinal plate and th