Package structure

The utility model provides a packaging structure. The packaging structure comprises a first substrate and a first electronic component. The first electronic component is disposed on the first substrate. The first substrate has an insulating material. Therefore, the electronic component can be arrang...

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Bibliographic Details
Main Authors WU JIFU, WU HAOYU
Format Patent
LanguageChinese
English
Published 21.10.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model provides a packaging structure. The packaging structure comprises a first substrate and a first electronic component. The first electronic component is disposed on the first substrate. The first substrate has an insulating material. Therefore, the electronic component can be arranged in the opening of the packaging structure so as to achieve miniaturization. 本公开提供一种封装结构。封装结构包括第一基底、第一电子元件。第一电子元件设置于第一基底。第一基底具有绝缘材质。由此，可将电子元件设置在封装结构的开口中，以达成小型化。
Bibliography:Application Number: CN202122050351U