Liquid cooling heat dissipation system

The utility model provides a liquid cooling heat dissipation system. The liquid cooling heat dissipation system comprises a cold head which is configured to cool a heating chip, and the interior of the cold head is provided with a liquid channel; the pump assembly is connected with the cold head and...

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Bibliographic Details
Main Author XU SHAOPING
Format Patent
LanguageChinese
English
Published 21.10.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model provides a liquid cooling heat dissipation system. The liquid cooling heat dissipation system comprises a cold head which is configured to cool a heating chip, and the interior of the cold head is provided with a liquid channel; the pump assembly is connected with the cold head and provides liquid flowing power; the cold radiator, the cold head and the pump assembly are connected through a liquid cooling pipe to form liquid flowing circulation; the fan assembly is configured to dissipate heat of the radiator; the temperature monitoring unit is configured to monitor the temperature of liquid at the inlet end of the cold head; and the control unit is configured to be in communication connection with the temperature monitoring unit, the fan assembly and the pump assembly, and the control unit can adjust the fan assembly and/or the pump assembly according to the liquid temperature monitored by the temperature monitoring unit. According to the technical scheme of the utility model, the liquid coo
Bibliography:Application Number: CN202221681272U