Novel impedance test probe
The utility model discloses a novel impedance test probe, which comprises a PCB (printed circuit board) with a ground layer, two signal lines which are mutually symmetrical and are not communicated with each other are arranged in the PCB, one ends of the two signal lines are respectively communicate...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
21.10.2022
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model discloses a novel impedance test probe, which comprises a PCB (printed circuit board) with a ground layer, two signal lines which are mutually symmetrical and are not communicated with each other are arranged in the PCB, one ends of the two signal lines are respectively communicated with two first signal bonding pads arranged at one end of the surface of the PCB, the two first signal bonding pads are respectively connected with different SMA (shape memory alloy) connectors, and the two first signal bonding pads are respectively connected with the ground layer. The other ends of the two signal lines extend to the other end of the PCB and then are respectively connected with two second signal bonding pads exposed out of the surface of the PCB, first ground bonding pads which are mutually symmetrical are arranged on the two common sides of the two second signal bonding pads, and the two first ground bonding pads are connected with a ground layer through a plurality of first ground holes formed |
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Bibliography: | Application Number: CN202221496136U |