Electromagnetic shielding heat dissipation mechanism and electronic equipment

The utility model discloses an electromagnetic shielding heat dissipation mechanism, which comprises a circuit board assembly, and further comprises a heat dissipation assembly arranged on the circuit board assembly, a metal shell covering the circuit board assembly and a plurality of grid holes for...

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Bibliographic Details
Main Author CUI JIANBO
Format Patent
LanguageChinese
English
Published 20.09.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The utility model discloses an electromagnetic shielding heat dissipation mechanism, which comprises a circuit board assembly, and further comprises a heat dissipation assembly arranged on the circuit board assembly, a metal shell covering the circuit board assembly and a plurality of grid holes formed in the metal shell, the heat dissipation assembly is located in the metal shell, and the grid holes are formed in the metal shell. The plurality of grid holes are arranged opposite to the heat dissipation assembly, and the circumcircle diameter of the cross section of each grid hole is smaller than or equal to half of the minimum wavelength of electromagnetic waves generated by the circuit board assembly. Therefore, according to the electromagnetic shielding heat dissipation mechanism disclosed by the utility model, the grid holes are formed in the metal shell, so that the grid holes can play roles in ventilation, heat dissipation and electromagnetic shielding, compared with the prior art, the heat dissipation
Bibliography:Application Number: CN202220780804U