Semiconductor wafer cutting device

• Main Author: LU JINFA
• Format: Patent
• Language: Chinese; English
• Published: 16.09.2022
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The utility model discloses a semiconductor wafer cutting device, and particularly relates to the technical field of semiconductor wafer cutting, which comprises a base, a supporting column is fixedly arranged at the top of the base, a sliding seat is arranged on the outer side of the supporting column, a sliding block is fixedly arranged on one side of the sliding seat, and a movable sliding block is arranged on the outer side of the sliding block. A supporting rod is fixedly arranged on one side of the movable sliding block, a sliding block is arranged on the outer side of the supporting rod, a laser cutting machine is fixedly arranged at the bottom of the sliding block, and a separating mechanism is arranged at the bottom of the laser cutting machine. The adjustable cutting mechanism is arranged, the fixing table is matched with the fixing clamping block to fix the wafer, the pressure pump is matched with the water outlet pipe to cool and wash the wafer during cutting, and when molecular attraction is gene