Frequency conversion mainboard with heat dissipation structure
The frequency conversion mainboard with the heat dissipation structure comprises a shell and a mainboard body, mounting plates are symmetrically and fixedly connected to the inner wall of the shell, damping connecting mechanisms are arranged between the mainboard body and the mounting plates, circul...
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| Main Authors | , |
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| Format | Patent |
| Language | Chinese English |
| Published |
02.09.2022
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| Subjects | |
| Online Access | Get full text |
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| Summary: | The frequency conversion mainboard with the heat dissipation structure comprises a shell and a mainboard body, mounting plates are symmetrically and fixedly connected to the inner wall of the shell, damping connecting mechanisms are arranged between the mainboard body and the mounting plates, circular grooves are symmetrically formed in the upper surface of the shell, heat dissipation holes are formed in the bottoms of the circular grooves in a penetrating mode, and the heat dissipation holes are communicated with the mounting plates. And a heat dissipation mechanism is mounted between the interior of the circular groove and the interior of the heat dissipation hole. According to the computer mainboard, through the arranged damping connecting mechanism, when vibration occurs, damping can be carried out on the mainboard body through the arranged damping spring, so that damage is avoided, heat dissipation can be carried out on the upper portion and the lower portion of the mainboard body at the same time throug |
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| Bibliography: | Application Number: CN202220362798U |