Automatic lifting device for ultrasonic degumming of diamond wafer

• Main Authors: ZHANG KUNFENG, GUO HAOYONG, ZHANG FENHONG
• Format: Patent
• Language: Chinese; English
• Published: 23.08.2022
• Subjects: CLEANING; CLEANING IN GENERAL; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; TRANSPORTING

The utility model provides an automatic lifting device for ultrasonic degumming of a diamond wafer, which comprises a supporting assembly arranged outside an ultrasonic degumming device, the supporting assembly comprises a base, the base is provided with a supporting frame, and the supporting frame is higher than the ultrasonic degumming device; the lifting assembly comprises a sliding block which is driven by a driving mechanism and is arranged on the supporting frame in a sliding mode, a carrier is fixedly arranged on the sliding block, a carrier part is arranged at the end, away from the sliding block, of the carrier, a glue removing hole is formed in the carrier part, the diameter of the glue removing hole is larger than that of a diamond wafer, and the glue removing hole is communicated with the carrier part. When a jig of which the bottom is adhered with a diamond wafer is placed on the carrying part, the diamond wafer extends into the photoresist removing hole; the control module comprises a liquid lev