Tray structure for assisting integrated circuit patch solder paste detection

• Main Author: XIE CHANGYI
• Format: Patent
• Language: Chinese; English
• Published: 19.08.2022
• Subjects: ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS; MEASURING; MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR; PHYSICS; TARIFF METERING APPARATUS; TESTING

The utility model discloses an auxiliary integrated circuit patch solder paste detection tray structure, which comprises a tray base, the upper surface of the tray base is provided with two mounting plates, the two mounting plates are symmetrically arranged front and back, the middle of the tray base is provided with a rotating shaft, a clamping mechanism is arranged between the two mounting plates, and the rotating shaft is arranged between the two mounting plates. The clamping mechanism comprises a rotating gear, the lower surface of the rotating gear is connected with the upper end of the rotating shaft, toothed plates are connected to the front end and the rear end of the rotating gear in a meshed mode, clamping plates are arranged at the right end of the toothed plate at the rear end and the left end of the toothed plate at the front end, and a limiting mechanism is arranged at the lower end of the tray base. By means of the clamping mechanism, the integrated circuit patch can be rapidly clamped and fixe