Clamping mechanism for aramid fiber base material monocrystalline silicon wafer

• Main Authors: GUO LILI, LIU PING, ZHANG JUNHUA, YE XIAOWEN, JIANG MING, SUN JING, WANG ZHIXIN, LI MINGTAO, WANG YUYANG, GUO XIAOTONG
• Format: Patent
• Language: Chinese; English
• Published: 05.08.2022
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

The utility model discloses a clamping mechanism for an aramid fiber base material monocrystalline silicon wafer, which relates to the technical field of monocrystalline silicon wafer processing, and comprises a workbench, three groups of limiting columns are fixedly connected above the workbench, a silicon wafer body is arranged among the three limiting columns, one side of the silicon wafer body far away from the single group of limiting columns is provided with an eccentric wheel, and the other side of the silicon wafer body far away from the single group of limiting columns is provided with an eccentric wheel. An air cylinder is fixedly installed in the middle of the lower portion of the workbench, the output end of the air cylinder is fixedly connected with a push rod, and a fixing device is arranged on the side, away from the double sets of limiting columns, of the silicon wafer body and comprises a U-shaped plate fixedly connected with the push rod. The upper portion of the U-shaped plate extends to th