Wallboard mold with adjustable thickness

• Main Authors: TAN ZHONGLU, WANG DAN, ZHANG WEI, WANG FENG, ZHU XITIAN
• Format: Patent
• Language: Chinese; English
• Published: 02.08.2022
• Subjects: PERFORMING OPERATIONS; SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG, OR MIXTURESCONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE

The utility model discloses a thickness-adjustable wallboard mould which comprises side plates, the side plates are symmetrically arranged, side plate assemblies are symmetrically arranged between the two side plates, a bottom plate is arranged at the bottoms of the side plate assemblies and the side plates, each side plate assembly comprises a baffle, compensation plates are symmetrically connected to the two sides of each baffle, and the two sides of each baffle are provided with a through hole. Insertion grooves are formed in the two sides of the baffle and one side of the compensation plate, insertion blocks are fixed to one side of the side plate and the other side of the compensation plate, the insertion grooves are matched with the insertion blocks, and supporting plates are symmetrically arranged on one side of the side plate. By adjusting the number of the compensation plates, the universality of the die is improved, the die manufacturing cost is reduced, the overall die machining time is shortened,