Touch control SIP circuit device and packaging structure thereof
The utility model discloses a touch control SI P circuit device and a packaging structure thereof, belongs to the technical field of touch switches, and aims to solve the problems that a capacitive touch switch is small in sensing area, low in integration level and prone to mutual interference. The...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
29.07.2022
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model discloses a touch control SI P circuit device and a packaging structure thereof, belongs to the technical field of touch switches, and aims to solve the problems that a capacitive touch switch is small in sensing area, low in integration level and prone to mutual interference. The device comprises a sensing module, an amplifying and filtering module and a shaping module, the sensing module is electrically connected with the amplifying and filtering module, the shaping module is electrically connected with the amplifying and filtering module, the sensing module is a piezoelectric MEMS structure sensing chip, and the amplifying and filtering module comprises an operational amplifier U1, an amplifying and filtering parameter adjusting peripheral device and a direct current bias circuit element. The amplification filtering parameter adjusting peripheral device comprises a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a capacitor C1 and a capacitor C3, the direct curren |
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Bibliography: | Application Number: CN202220584946U |