Heat flux density guide structure of upper cover of vapor chamber

• Main Authors: DING XINGQIANG, XIE YI, LI KAIKAI
• Format: Patent
• Language: Chinese; English
• Published: 08.07.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses a heat flux density guide structure of an upper cover of a vapor chamber, and belongs to the technical field of vapor chambers. Comprising an upper cover plate, supporting columns are densely distributed on the upper cover plate, a plurality of heat flow density guide grooves are formed in the upper cover plate in the width direction of the upper cover plate in an array mode, the upper ends of all the heat flow density guide grooves are horizontally formed and located on the upper portion of the upper cover plate, and the lower ends of all the heat flow density guide grooves are located on the lower portion of the upper cover plate. The horizontal heights are different from each other; according to the utility model, the vapor chamber with single-point heating is designed in a targeted manner, multidirectional heat conduction is realized through single-point heating, the heat conduction efficiency is improved, the working fluid can rapidly and completely circulate in the vapor cham