High-precision multilayer circuit board

• Main Authors: WANG KUN, SHEN MINGLI, YANG HONGYU, NIU ZHENJIANG
• Format: Patent
• Language: Chinese; English
• Published: 05.07.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

A high-precision multilayer circuit board comprises a shell, more than two circuit boards, two limiting shells, a plurality of locking pieces and a heat dissipation metal plate, the more than two circuit boards are sequentially overlapped, the heat dissipation metal plate is arranged between the two circuit boards, the limiting shells are installed at the two ends of the overlapped circuit boards, and the locking pieces are installed on the limiting shells. The circuit board is locked and pressed in the limiting shell by the locking piece; the overlapped circuit board is arranged in the shell; the circuit board comprises a body part, circuit layers arranged on the upper side and the lower side, heat dissipation layers arranged on the outer sides of the circuit layers and insulating layers, threaded holes are formed in the body part, guide holes are formed in the insulating layers, positioning holes are formed in the heat dissipation layers and the circuit layers, and the guide holes, the positioning holes and