Radiating device combination

• Main Authors: LIN SHENGHUANG, LIN YUANYI
• Format: Patent
• Language: Chinese; English
• Published: 24.06.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model provides a heat dissipation device combination, which comprises an aluminum base, an aluminum fin group and at least one U-shaped upright or inverted copper heat pipe, the aluminum base is provided with at least one combination part, a copper imbedding layer is arranged on the combination part, the aluminum fin group is assembled on the aluminum base, and the U-shaped upright or inverted copper heat pipe is arranged on the aluminum base. The copper heat pipe is provided with a heat dissipation part and a heat absorption part which are respectively combined on the combination part of the aluminum fin group and the aluminum base, and the heat dissipation device is provided with the copper imbedding layer, so that the aluminum base and the copper heat pipe can be directly welded and combined without electroless nickel treatment. 本实用新型提供一种散热装置组合，包括一铝制基座、一铝制鳍片组及至少一U型呈正置或倒置的铜制热管，该铝制基座具有至少一结合部，且该结合部上设有一铜质置入层，所述该铝制鳍片组系组设在该铝制基座上，所述该铜制热管具有一散热部及一吸热部分别结合在该铝制鳍片组与该铝制基座的结合部上，本实用新型的散热装置借由该铜质置入层的设置，令该铝制基座与该铜