Miniature temperature measuring device and application system

• Main Authors: WANG HONGSONG, MA CHUNHUA
• Format: Patent
• Language: Chinese; English
• Published: 31.05.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING QUANTITY OF HEAT; MEASURING TEMPERATURE; PHYSICS; SEMICONDUCTOR DEVICES; TESTING; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR

The utility model discloses a miniature temperature measuring device and an application system. The miniature temperature measuring device comprises a packaging substrate, a plurality of miniature heat conduction pipes and a plurality of silicon chips. The miniature heat conduction pipes are installed on the back face of the packaging substrate in a honeycomb array structure, cooling agents are stored in the miniature heat conduction pipes where the back face of the packaging substrate is located, and a silicon chip is installed in the area, corresponding to each miniature heat conduction pipe, of the front face of the packaging substrate so as to achieve high-density temperature measurement on the surface of a measured object in space and time. According to the utility model, the fineness of the temperature measurement technology in time and space is greatly improved. 本实用新型公开了一种微型测温设备及应用系统，该微型测温设备包括封装基板、若干微型导热管以及若干硅芯片；微型导热管呈蜂窝阵列式结构安装在封装基板背面，且封装基板背面所在的微型导热管内存储有冷却剂，每个微型导热管所对应的封装基板正面区域安装一个硅芯片，以对被测物表面实现空间及时间上的高密