5G edge computing server with heat dissipation structure

• Main Authors: ZENG XIANGCONG, ZHAN SHUJING, GAO PENG, WANG WANDA, XU YANPING, LIU CHUNJIAN, NIE KAIPENG
• Format: Patent
• Language: Chinese; English
• Published: 10.05.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The 5G edge computing server with the heat dissipation structure comprises a shell, the front end of the shell is fixedly connected with an installation cover plate, the top end of the shell is fixedly connected with an end cover, and the rear end of the bottom of the shell is fixedly connected with...