5G edge computing server with heat dissipation structure

• Main Authors: ZENG XIANGCONG, ZHAN SHUJING, GAO PENG, WANG WANDA, XU YANPING, LIU CHUNJIAN, NIE KAIPENG
• Format: Patent
• Language: Chinese; English
• Published: 10.05.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The 5G edge computing server with the heat dissipation structure comprises a shell, the front end of the shell is fixedly connected with an installation cover plate, the top end of the shell is fixedly connected with an end cover, and the rear end of the bottom of the shell is fixedly connected with a fixed transverse plate. According to the 5G edge computing server with the heat dissipation structure, a heat dissipation grid is fixedly connected to the interior of a mounting cover plate, a heat dissipation fan is mounted and positioned through a mounting frame fixedly connected to one end of the heat dissipation grid during use, and the heat dissipation fan and the mounting frame are connected and fixed through a fixing rod; heat generated during operation of the computing server is absorbed through the heat dissipation copper pipes connected to the interior of the shell through the fixing blocks, is uniformly and rapidly dissipated through the heat dissipation fins and is discharged out of the computing ser