High-performance integrated circuit board

• Main Authors: ZHENG HAIYANG, LI JUNSHUAI
• Format: Patent
• Language: Chinese; English
• Published: 10.05.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses a high-performance integrated circuit board, which relates to the technical field of integrated circuit boards and comprises a mounting seat, an integrated circuit board is arranged in an inner cavity of the mounting seat, fixing blocks are fixedly connected to two ends of the inner sides of two sides of the mounting seat, and a connecting block is arranged between the two fixing blocks. Clamping grooves are formed in the middles of the side faces, close to each other, of the two connecting blocks, the two ends of the integrated circuit board are located in inner cavities of the two clamping grooves respectively and matched with the clamping grooves, and guiding sliding grooves are formed in the upper ends of the side faces, close to each other, of the two fixing blocks. The connecting blocks are arranged between the two fixing blocks, the clamping grooves are formed in the side faces, close to each other, of the two connecting blocks, the guide sliding blocks located in inner cavi