PCS modular three-level inverter module installation structure

• Main Authors: TANG BO, ZHANG MING, LIANG GUANGYAO, XU DIFEI
• Format: Patent
• Language: Chinese; English
• Published: 08.04.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses a PCS modular three-level inverter module installation structure, which comprises a box body, a wiring area arranged at the lower end of the box body, a fan installation area arranged at the upper end of the box body, an installation plate arranged in the box body and fixedly connected with the box body, the installation plate located between the wiring area and the fan installation area, a plurality of wiring copper bars installed in the wiring area, and a plurality of wiring copper bars installed in the fan installation area. A plurality of heat dissipation fans are installed in the fan installation area, an upper installation area and a lower installation area are installed on the installation plate, an IGBT module is installed in the upper installation area, and a direct current supporting capacitor is installed in the lower installation area. According to the PCS modular three-level inverter module installation structure, the layout structure of each device inside is optimized