Film pressing device for semiconductor device

• Main Authors: ZHOU XINLONG, PAN LINGZI, CHO SEUNG-HYUN, LI XIN
• Format: Patent
• Language: Chinese; English
• Published: 08.04.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The utility model relates to a film pressing device for a semiconductor device. The device comprises a film pressing head, the film pressing head comprises a base connecting end and a film pressing end, the base connecting end is fixedly connected with the film pressing end, the film pressing end is provided with an end face groove, a *-shaped channel groove is formed in the end face groove, and channel grooves in all directions of the *-shaped channel groove are communicated with one another. Soldering tin and bubbles thereof gathered in different directions can be guided or guided nearby, the guiding and air guiding efficiency is improved, meanwhile, the soldering tin and the bubbles thereof are prevented from being gathered in a specific channel groove, and therefore the mobility of the soldering tin and the bubbles thereof is improved, soldering tin distribution is more uniform, and the forming effect is good. 本申请是关于一种半导体器件压膜装置。该装置包括压膜头，该压膜头包括基座连接端和压膜端，基座连接端与压膜端固定连接，压膜端设置有端面槽，端面槽内设置有米字型通道槽，米字型通道槽的各方向通道槽相互