Frit packaging device

• Main Authors: LIN ZHIBIN, CHEN YUPING, WU CONGYUAN
• Format: Patent
• Language: Chinese; English
• Published: 22.03.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a Frit packaging device, which comprises a glass cover plate, a mould and a heating part, the mould is erected on the glass cover plate, a hydrophobic coating is arranged on the contact surface of the mould and Frit glue, a plurality of groups of hollow parts are arranged on the mould, the Frit glue is dispensed on the hollow parts or the Frit glue is subjected to silk-screen printing, UV (ultraviolet) glue is arranged on the outer side of the Frit glue, and the heating part is arranged on the inner side of the mould. According to the utility model, the fluidity of the Frit glue in a wet glue state is limited in a mode of arranging the mold which is provided with the hydrophobic coating on the contact surface with the Frit glue and is internally provided with the heating parts at the periphery, and meanwhile, the Frit glue in the wet glue state in an ideal shape can be shaped in time, so that the Frit glue can obtain the desired ideal shape, and the problem of saddle shape is solve