Semiconductor device for curing dielectric material at low pressure

The utility model relates to the technical field of semiconductor manufacturing and packaging, and provides a semiconductor device for curing a dielectric material coating at low air pressure, which comprises a wafer placing frame. A wafer table tray; and a chamber for curing the wafer at low pressu...

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Bibliographic Details
Main Author YAO DAPING
Format Patent
LanguageChinese
English
Published 04.03.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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