Semiconductor device for curing dielectric material at low pressure

• Main Author: YAO DAPING
• Format: Patent
• Language: Chinese; English
• Published: 04.03.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model relates to the technical field of semiconductor manufacturing and packaging, and provides a semiconductor device for curing a dielectric material coating at low air pressure, which comprises a wafer placing frame. A wafer table tray; and a chamber for curing the wafer at low pressure. According to the utility model, the heating layer around the curing treatment chamber of the low-pressure wafer curing treatment device is adopted to provide heat for the wafer in the chamber, and high-purity gas flowing to the chamber is heated at the same time, and is uniformly fed into the chamber to uniformly heat the wafer placed in the chamber. By reducing the air pressure of the cavity and controlling the curing process of the dielectric material, the stress formed when the coating on the surface of the wafer is cured is reduced, so that the dielectric material coating obtains better performance, and meanwhile, the buckling deformation of the wafer is effectively inhibited. 本实用新型涉及半导体制造与封装技术领域，提出一种低气压固化处